Adeia Sues AMD Over Semiconductor Patents, Including Advanced 3D Stacking Used In Ryzen X3D CPUs
Adeia Sues AMD Over Semiconductor Patents, Including Advanced 3D Stacking Used In Ryzen X3D CPUs
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Adeia Sues AMD Over Semiconductor Patents, Including Advanced 3D Stacking Used In Ryzen X3D CPUs

🕒︎ 2025-11-03

Copyright Wccftech

Adeia Sues AMD Over Semiconductor Patents, Including Advanced 3D Stacking Used In Ryzen X3D CPUs

IP licensing firm Adeia is taking AMD to court, alleging that the company has used Adeia's semiconductor patents in its products. AMD in Trouble as Adeia Files Two Patent Infringement Lawsuits; Claims it Negotiated for Years Before Filing Lawsuits The Intellectual Property licensing company Adeia has filed two patent infringement lawsuits against AMD, alleging that AMD has utilized its patented innovations for its chips without proper authorization. The case was filed in the US District Court for the Western District of Texas recently, and according to Adeia, AMD has relied on its patented technologies for years. This includes innovations related to hybrid bonding, which is used in AMD 3D V-Cache processors, giving AMD a significant edge over Intel in the client segment. This hybrid bonding has been the key technology in AMD's success since 2022, which resulted in significant improvement in gaming performance and select applications. Adeia claims that it has tried to reach a licensing agreement with AMD, but even after long discussions over the years, it has had no success. So, finally, Adeia has decided to take legal action against AMD. For years, AMD’s products have incorporated and made extensive use of Adeia’s patented semiconductor innovations, which have greatly contributed to their success as a market leader. After prolonged efforts to reach a mutually agreeable resolution without litigation, we believe this step was necessary to defend our intellectual property from AMD’s continued unauthorized use. - Adeia The lawsuit covers ten patents: seven of them are related to hybrid bonding, and three relate to advanced semiconductor process technologies. Even though it has filed the lawsuit, it is still open to negotiation, but is also "fully prepared" to pursue the case in court if needed. This means AMD may need to pay significant licensing fees, which would mean AMD's products using the 3D-stacked packaging could face royalty costs. This could impact AMD's long-term roadmap, and as of now, AMD hasn't yet issued a public response to this complaint. Keep in mind that AMD's chips are created by TSMC, but Adeia didn't file a lawsuit against TSMC, since TSMC is just a contract manufacturer. So, Adeia decided to go against AMD, which is the designer and beneficiary. That said, it's common to see patent disputes in the semiconductor industry, but this one is crucial for AMD to resolve due to its timing and target. News Source: via Overclock3D

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