Micron has confirmed shipping the industry’s fastest 11 Gbps HBM4 DRAM to customers & TSMC partnership for next-gen HBM4E.
Micron Says It Has Outperformed The Competition With Its 11 Gbps HBM4 Memory, Will Partner With TSMC For HBM4E DRAM
During its latest earnings call for Q4 & FY2025, Micron announced some key developments in its DRAM and NAND Flash segments. As far as the earnings go, the company posted a revenue of $11.32 billion versus $9.30 billion in the previous quarter, while the full-year revenue grew from $25.11 billion to $37.38 billion. The company is now looking to expand its performance with next-gen solutions.
Starting with HBM, Micron said that its HBM4 12-Hi DRAM solution remains on track, and to address the recent increase in performance requirements, the company has produced and shipped the first samples of its fastest HBM4 solution to date, offering over 11 Gbps pin speeds and 2.8 TB/s of bandwidth. They state that the new HBM4 products should outperform all competition in terms of performance and efficiency.
We are pleased to note that our HBM share is on track to grow again and be in line with our overall DRAM share in this calendar Q3, delivering on our target that we have discussed for several quarters now. Micron Technology’s HBM4 12-hi remains on track to support customer platform ramps, even as the performance requirements for HBM4 bandwidth and pin speeds have increased.
We have recently shipped customer samples of our HBM4 with industry-leading bandwidth exceeding 2.8 TB/s and pin speeds over 11 Gbps. We believe Micron Technology’s HBM4 outperforms all competing HBM4 products, delivering industry-leading performance as well as best-in-class power efficiency. Our proven 1-gamma DRAM, innovative and power-efficient HBM4 design, in-house advanced CMOS base die, and advanced packaging innovations are key differentiators enabling this best-in-class product.
Sanjay Mehrotra – Micron President & CEO
Besides HBM4, the company also talked about the next-gen HBM4E memory. Unlike HBM, which is based completely on an in-house & advanced CMOS base die, Micron will partner with TSMC for manufacturing the base logic die for HBM4E memory. This will be true for both standard and custom variants. Micron has also highlighted that they expect HBM4E to be a 2027 product.
For HBM4E, Micron Technology will offer standard products as well as the option for customization of the base logic die. We are partnering with TSMC for manufacturing the HBM4E base logic die for both standard and customized products. Customization requires close collaboration with customers, and we expect HBM4E with customized base logic dies to deliver higher gross margins than standard HBM4E. Our HBM customer base has expanded and now includes six customers.
We have pricing agreements with almost all customers for a vast majority of our HBM3E supply in calendar 2026. We are in active discussions with customers on the specifications and volumes for HBM4, and we expect to conclude agreements to sell out the remainder of our total HBM calendar 2026 supply in the coming months.
Sanjay Mehrotra – Micron President & CEO
Moving onward, Micron says that they have closely collaborated with NVIDIA for the adoption of LPDDR memory for servers, making them the sole supplier of LPDDR DRAM in the data center segment. Micron also talks about GDDR7 memory for AI and Client products. The memory is expected to exceed 40 Gbps pin speeds with future iterations and products. Currently, NVIDIA is the only GPU maker that leverages GDDR7 for its GPUs. Inititally, Micron announced GDDR7 with 32 Gbps pin speeds so 40 Gbps will mark a 25% speedup over that.
n close collaboration with NVIDIA, Micron has pioneered the adoption of LPDRAM for servers, and since NVIDIA’s launch of LPDRAM in their GB product family, Micron has been the sole supplier of LPDRAM in the data center. In addition to our leadership in HBM and LP5, Micron is also well-positioned with our GDDR7 products, which are designed to deliver ultra-fast performance with pin speeds exceeding 40 Gbps, along with best-in-class power efficiency to address needs of certain future AI systems.
Sanjay Mehrotra – Micron President & CEO